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AMETEK AEGIS
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Patents
Want to know more about the AMETEK AEGIS product patents? The list is organized by product line is available by clicking the PLUS sign. Then you can view or download AMETEK AEGIS product patents.
Packaging Product Patents
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Surface mount device with high thermal conductivity (US5111277)
Duplex feedthrough and method
Heat spreader for use with light emitting diode
Hermetically Sealed Package
Hermetic Semiconductor Package
Initiator header subassembly for inflation devices
Optical component package with a hermetic seal
Shaped Ceramic Feedthrough
Surface mount package with ceramic sidewalls
Surface mount package with high thermal conductivity (US20100013084A1)
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